Last Updated： Aggregation Period:Jul 08, 2026～Aug 04, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 08, 2026～Aug 04, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 08, 2026～Aug 04, 2026
This ranking is based on the number of page views on our site.
1～7 item / All 7 items
Demo units available for loan! It includes brush cleaning and fine jet cleaning.
This machine is a resist stripping device. The robot automatically transports the cassette set in the loader, goes through each processing stage, dries it with hot air blow/spin dryer, and discharges it to the unloader. For more details, please contact us.
By eliminating the liquid medication cleaning process, it is possible to reduce the installation area of the wet bench!
"AURORA" is a low-temperature resist stripping device that can remove resist after ion implantation. By combining plasma treatment and ozone water treatment, it can strip without residue, and it also supports stripping of underlying films (such as Si, SiO2) without film edge issues. Additionally, by eliminating chemical cleaning processes such as sulfuric peroxide and ammonia peroxide, it is possible to reduce running costs and the number of processes. A fast removal rate (2-4μm/min) achieves high throughput. [Features] ■ Stripping performance ■ Cost reduction ■ Reduction of process steps ■ Reduction of installation area *For more details, please feel free to contact us.
Introducing a system that automatically processes each step from stripping, rinsing, to spin drying!
We would like to introduce the "Sheet-Type Resist Stripping Device" that we handle. By simply setting a FOUP or dedicated cassette on the load port, the clean robot automatically transports the workpieces. It is also capable of manufacturing manual development devices. The work materials supported include Si, SiC, GaN, GaAs, InP, ceramics, quartz, resin, glass, SUS plates, and more. 【Specifications (partial)】 ■ Two-stage cup (upper stage: resist, lower stage: rinse) ■ Stripping solution: DMSO/TMAH, polyimide, etc. (independent chamber) ■ Rinse solution: polyimide, etc. ■ Back rinse: DIW, polyimide, reusable liquid, etc. ■ Stripping and rinse solution supply and recovery tank can be built into the device *For more details, please download the PDF or feel free to contact us.
Advanced horizontal stripping for PCB/PCM. High-impact spray ensures zero resist residue even in high aspect ratio structures.
The Höllmüller STRIP by TSK Schill is a high-performance horizontal stripping system designed for the complete and uniform removal of photoresists from PCBs and various metal surfaces. A key challenge in fine-circuit manufacturing is ensuring that no micro-residues are left behind, which can lead to defects in subsequent processes. This system utilizes advanced spray technology and an integrated recovery unit to rapidly and effectively remove stripped resist. By overcoming the "puddle effect" through optimized fluid dynamics, it ensures consistent chemical interaction across the entire substrate surface, delivering a perfectly clean finish even for complex, high-density designs. The system is engineered for 24/7 industrial durability, featuring a robust 15mm thick polypropylene (PP) structure. It is the trusted solution for high-volume production of advanced electronics where zero-defect reliability is mandatory.
Achieving both peeling performance and a compact footprint that supports high-precision MEMS manufacturing.
In the MEMS industry, as microfabrication technology advances, high precision and quality in the resist stripping and lift-off processes are required. In particular, the uniformity of the wafer surface and the suppression of contamination are crucial, and addressing these challenges is essential for improving product yield. This device achieves high stripping performance through the combination of heated organic solutions and high-pressure jets. It is a one-chamber system that contributes to high throughput and a reduced footprint. 【Application Scenarios】 - Resist stripping and lift-off processes in MEMS device manufacturing - Processes requiring high-precision pattern formation - Processes needing wafer surface uniformity and contamination control 【Benefits of Implementation】 - Improved yield due to high stripping performance - Increased efficiency of manufacturing lines through reduced footprint - Reduced running costs through the reuse of chemicals
High-performance resist stripping equipment that supports the microfabrication process.
In the semiconductor industry's miniaturization process, precise stripping of the resist is essential. Particularly, as density increases, the presence of resist residues and foreign substances can significantly reduce yield. Our batch-type automatic resist stripping and lift-off equipment achieves high stripping performance through a combination of heated organic chemicals and high-pressure jets. 【Application Scenarios】 * Resist stripping in microfabrication processes * Research and development applications * Small-scale production 【Benefits of Implementation】 * Improved yield due to high stripping performance * Enhanced installation efficiency through space-saving design * Reduced running costs through chemical reuse
Resist stripping and lift-off equipment supporting the manufacturing of high-precision MEMS devices.
In the MEMS industry, the quality of resist stripping and lift-off processes is crucial for the manufacturing of high-precision devices. Particularly in MEMS devices that utilize microfabrication technology, residual resist and uneven stripping can negatively impact product performance and reliability. Our batch-type automatic resist stripping and lift-off equipment achieves high-precision stripping performance by combining heated organic solutions with high-pressure jets for physical assistance. 【Usage Scenarios】 - Resist stripping and lift-off processes in MEMS device manufacturing - Resist removal in microfabrication processes - Resist stripping for research and development purposes 【Benefits of Implementation】 - Improved device quality through high-precision stripping - Increased productivity through high throughput - Reduced running costs through the reuse of solutions
